Given the integrated circuits (IC) production scale, the amount of process control monitoring (PCM) data enable to develop an efficient algorithm for IC yield prediction at the die-level. Therefore, in addition to cost-effective and time- efficient yield evaluation, the proposed model is able to identify failed dice and low-yield areas on a wafer without any direct electrical die testing. Additionally, for non-parametric random dice failure detection that are untraceable by PCM input based models, an ensemble learning including both PCM and die defect inspection data are described. As Wafer Sort (WS) consumes a lot of time and resources with high associated cost a significant cost reduction can be achieved using smart product routing with selective WS by employing the aforementioned die level predictive model.
Published at 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs (USA) in 2022 and available on IEEE Xplore.