Join Us at ESREF Toulouse 2023!
We are thrilled to announce that Inference Technologies will be attending ESREF 2023, the European Symposium on Reliability of Electron Devices Failure Physics and Analysis. As our CEO Petr Lenhard presents the latest paper, we would be delighted for you to join us.
Die Level Predictive Modeling to Reduce Latent Reliability Defect Escapes
This paper presents a die-level screening method based on inline defect inspection that uses advanced predictive engines to generate die-level failure probabilities to filter dice with high-reliability risk if the predicted probability is higher than a selected limit. The method uses the relationship between ’killer’ and latent defects to identify potentially unreliable dice that have passed the Wafer Sort. A novel approach of saliency map clustering algorithms is applied to increase the level of granularity in latent defect detection beyond supervised defect classification.
Full Paper
Will be published in the Microelectronics Reliability journal Volume 148, September 2023 and is available here.
Connect With Us
To schedule a meeting with our team during the event, please contact us using the form or at contact@inferencetech.com.
We can't wait to see you there!